There are two main thermal management solutions to solar cell mounting being utilized today: the use of
thermally conductive epoxies and the implementation of void-free soldering. Each of these solutions involve
unavoidable short comings which prevent current technologies from exploiting their full potential.
The first solution, mounting via thermally conductive epoxy, involves a relatively high thermal resistance as compared to the void-free soldering solution or the Solstice concept. This is because the epoxies have a large bond line thickness and insufficient thermal conductivity. Void-free soldering has a lower thermal resistance than the epoxy, but is still roughly seven times higher than the potential of the Solstice pressure fit mounting concept. In addition, in order to implement soldering techniques it is required that one do so with vacuum forming processes which translate to high manufacturing costs. Without vacuum forming, the solder can contain air voids which lead to thermal run away and mechanical failure once the assemblies are placed under a solar load.
The Solstice High Heat Transfer Cell Mount utilizes mechanical means of fixing chips to their substrate and optimizes the thermal resistance of the system to maximize heat transfer and keep chips cool under operation.
Our CPV system tests have shown that under 800X concentration, we maintained a steady state temperature differential of 9C between the solar cell face and coolant temperatures, or about 7X better than today’s industry leading alternative methods. Contact us to find out more!